Supermini Chip Placement Quick Changeover IC Bonder CBD2200
Special use type high precision IC bonder, for a variety of small batch of placement products. It can automatically switch to a variety of bonding heads, and quickly realize the placement of different parameters of a variety of chips.
Features:
- Supermini chip placement
- Ultrathin die bonding technology
- Automatic nozzle change
- Bottom photo-taking, high precision placement
- Quick changeover
Main application:
It is suitable for a variety of small batch of placing products, automatically switch to a variety of mounting head, quickly achieve to place a variety of chip with different. It is mainly used in the military products RF and power module power amplifier.
Product Parameters:
| Item | Specification |
| Placement accuracy | ±10um@3σ |
| Placement angle accuracy | ±0.3°@3σ |
| Loading mode | Wafer box |
| Die size(mm) | 0.25*0.25mm-10*10mm |
| PCB size(mm) | L300*W100 |
| Placement head | 0-360°rotation/Auto change nozzle(option) |
| Placement pressure(N) | 30-500g |
| Glue feeding mode | Support: dispensing, dipping, painting |
| Core motion module | Linear motor + grating scale |
| Platform base of machine | Marble platform |
| Machine dimension(L×W×H) | 1610mm×1380mm×1620mm |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.
5.The ground is required to withstand a pressure of 800kg/m².
Product Tags:
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Quick Changeover IC Die Bonding Machine Supermini Chip Bonding Machine Images
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